The hybrid-composite rear load floor uses unidirectional (UD) thermoplastic tapes plus direct-long-fiber thermoplastic (D-LFT) composites. Thermoplastic tapes provided high stiffness/strength in a ...
System-in-Package (SiP) technology has been used for a wide range of electronic devices, but the warpage behavior of the package can be difficult to control and predict due to complex manufacturing ...